Miejsce pracy: Anglia, Berkshire, Buckinghamshire and Oxfordshire
Rodzaj umowy o pracę: na czas nieokreślony, pełny etat

Wymagane wykształcenie:
Oferowana płaca: Nie podano
Liczba miejsc: 1

branża

Robotnicy obróbki metali i mechanicy maszyn i urządzeń
   Formierze odlewniczy, spawacze, blacharze, monterzy konstrukcji metalowych i pokrewni
        Blacharze

ZAKRES PRACY:

Key Words: IC, Production, Test, Manufacturing, Hardware, Software, RF, Teradyne, UltraFlex, Verigy, LTX, STDF, Wifi, Wimax, LTE, Wafer, Analogue. I have just been instructed to recruit a Principal IC Manufacturing Test Development engineer for a well established technology company based in Reading. The company are looking for somebody to come in a lead engineer to manage a Production test engineer, and help drive projects. Role: Principal IC Manufacturing Test Development Engineer Salary: £60,000 + Benefits Location: Reading The Role: * Technical and project lead overseeing the project planning and execution, including managing the day to day activities of another Senior Production Test Engineer. * Set the direction for a flexible test platform to support our next generation products. * Create the Production Test Plan for both RF and BBIC chips. * Successful integration of the Production test plan, software and hardware into high volume manufacturing facility in the Far East. Some travel required. * Includes tester platform selection, HW and Software development and off-shore transfer to Assembly and Test House (OSAT). * Evaluation of system performance and compliance with specifications and customer requirements. * Responsible for testing and evaluating chips returned from customers as well as productivity improvements in yield and cost. Key Skills: * Engineering degree in a relevant discipline. BSc, MSc or equivalent * 10 to 15 years experience of relevant IC Production Test development. * Experience in leading, managing and planning others day to day work on a project. * Production Tester HW and Software development experience on testers such as Teradyne UltraFlex, Verigy, LTX, etc… is a must. * Recent successful RF and digital factory introductions of highly complex RF transceivers and/or digital baseband chips, ideally related to broadband wireless communication systems, e.g. WiFi, WiMax or LTE, on a nano-metre scale RF-CMOS technology * Statistical analysis capabilities as well as the manipulation of STDF files. Desirable Skills: * Experience in wafer level analog and/or RF testing * WLCSP with narrow bump pitch (<350um). * Knowledge of Design for Manufacture considerations on cutting edge processes * Full appreciation of RF and baseband production test techniques The company are interviewing candidates immediately, so have asked me to collate CV s as soon as possible. If this sounds like you then I would advise getting in contact as soon as possible. The company is a well established multi-national company working on the latest telecommunications products. The company are offering a fantastic remuneration package, with a competitive salary, bonus scheme, 25 days holiday, pension and private healthcare. If you would like to learn more about the role, and think you have the skill set required, please get in contact with me at Computer Futures on 0117 910 33 55. I am also looking to grow my connections on LinkedIn, click the Link and connect today!

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source: https://www.ec.europa.eu/eures

  
     


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